Important information when updating from an early version The XFE option provides crosshatch return path modelling for flex and flex-rigid PCBs The Si8000m links with Speedstack as Speedstack PCB. The Si8000m assumes negligible insertion loss in the transmission line should you wish to model insertion loss the Si9000e adds extensive insertion loss modeling capabilities The Si8000m adds enhanced modelling to predict the finished impedance of multiple dielectric PCB builds and also takes into account the local variations in dielectric constant on close spaced differential structures. The Si8000m is a boundary element method field solver that builds on the familiar easy to use user interface in earlier Polar impedance design systems. View video – import and chart logged data from CITS Sitemap – for single and multiple dielectric PCBs The basic steps of loading the model, seaming edges, unfolding, arranging parts and editing flaps are discussed.Polarsi8000 simulated tools in PCB design layoutĬomparing measured with modeled impedance. Use Pepakura Designer to turn a 3D mesh model into a 2D pattern suitable for building out of paper. The parts with the same material are placed close. The algorithm of unfold has been updated The edges between faces of different materials are always separated.
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